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It is indispensable for miniaturization of electronic equipment
Precise plating for ultrafine productsERG Co.,Ltd

2018.03.23

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Coil spring with wire diameter of 16 μm used for contact prove

Learnning Points

  • The technological capability that can meet the specifications the times want
  • Eliminate difficulty of immersion in an ultra-fine plating solution with original know-how
  • The pursuit of smaller things, difficult plating

Plating on fine articles requiring technical strength.

Due to technological innovation in various fields, the miniaturization of electronic components has been further advanced. In particular, plating technology is indispensable for imparting special functions such as conductivity, heat resistance, abrasion resistance and the like to electronic parts. Advancement of plating technology for fine products is required as electronic components become smaller. In particular, the coil spring used for fine contact probes for electrical inspection and testing of the electronic board is not subjected to surface treatment to 13 μm, which is only 1/6 of the average hair thickness of 0.08 mm (80 μm) Since its founding in 1947, ERG Co.,Ltd., pursuing plating technology for fine items, successfully developed precision plating technology for ultra-fine products with a wire diameter of 13 μm in February 2017.

Super fine product not sinking into the plating solution.

Typically, to apply a plating process, unless it is immersed firmly in various solutions such as an acidic solution and an alkaline solution, it becomes "Un plated" which does not coat in the plating. Particularly when it becomes a fine article or an ultrafine article, since it floats due to the surface tension of the solution, it was challenging to apply a high-quality plating processing. However, with its proprietary technology of placing on the porcelain and plating with stirring, it established a technique to immerse in ultrafine products even in ultrafine products, making it possible to perform plating with uniform film thickness.

Precision plating for ultrafine products can correspond to gold / gold-Ni alloy, electroless gold / electroless Ni - B, rhodium, palladium nickel, and it is also possible to improve individual function performance by plating several kinds of plating. It is impossible to automate ultrafine plating due to process differences due to materials, etc. in addition to temperature and concentration control of several tens or more kinds of solutions. Therefore, although it is done 100% manually, thanks to the skilled staff, more than 300,000 plating processes higher than the client's requirement are possible.

Improvement of plating technology without compromising.

Coil springs are not the only things that require high plating technology. Other problems may occur when plating treatment such as blind holes, blind holes, air pocket box shapes and the like.
The problem is that it is difficult to put on the plating solution, so no plating or the like will occur as with fine products. Also in the pretreatment process, since the liquid is not suitable, it becomes insufficiently washed, and it is difficult to perform high-quality plating treatment. However, we put the product in a jig called a "Net basket," using unique technology including the "Netting method" to shake the product by rubbing the product in the manner of papermaking to make Japanese traditional paper, and plating processing, allowing plating on various fine items. Based on the corporate philosophy of "To create new value through the technology and results of surface treatment," we continue to pursue an insatiable search for improvement of plating technology.

  • "Plating," is one of the surface treatments, essential for miniaturizing smartphones and other electronic devices.
    Even if it is technically possible to downsize an electronic substrate, a fine contact probe, which can inspect and test whether it can be used safely, is essential. For this reason, precision plating to fine articles that can be examined is required. In other words, it will be possible to downsize electronic devices further only when the current 13 μm thick plating technology is established.

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①Precision plating on small parts
Plating on coil springs wound with 13 μm-diameter wire rods, on pins with an outer diameter of 70 μm, which is finer than a hair, etc.
②Inner surface plating for blind holes Plating on the inner surface of holes with a diameter of 1 mm or less
③Plating on parts that are easily assembled or bonded while being processed
For parts that may be assembled while being rotated or that have no hook portion, we use our specialized ”netted plating” method.

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